Two of the world’s leading semiconductor manufacturers, Intel and IBM, announced a shared investment Tuesday of $4.4 billion to develop cutting-edge chip technology in the state of New York. The partnership, a continuation of a decade-long project, has two main goals. First, the industry aims to increase the size of a wafer to 450 millimeters, allowing more chips to be placed on a wafer, which will provide benefits in economy of scale. IBM, Intel and other partners including Samsung, Globalfoundries and Taiwan Semiconductor Manufacturing Company will collaborate on those efforts.
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Intel and IBM Form Chip Research Tag Team
Posted by: Rachelle Dragani September 28, 2011 10:54 AMTwo of the world’s leading semiconductor manufacturers, Intel and IBM, announced a shared investment Tuesday of $4.4 billion to develop cutting-edge chip technology in the state of New York. The partnership, a continuation of a decade-long project, has two main goals. First, the industry aims to increase the size of a wafer to 450 millimeters, allowing more chips to be placed on a wafer, which will provide benefits in economy of scale. IBM, Intel and other partners including Samsung, Globalfoundries and Taiwan Semiconductor Manufacturing Company will collaborate on those efforts.