Intel has revealed plans to extend the number of transistors the company can put on chips with existing equipment. The next-generation technique includes a 65-nanometer process that the company said will help develop more capable processors and larger, more cost-effective 300-nanometer wafers, which are used for processors and other semiconductor manufacturing products. Intel said it will begin using the new manufacturing techniques in 2005, when it will be able to double the number of transistors the company can put on a single chip today.
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Intel Demonstrates Next-Gen Chip Process
Posted by: Jay Lyman November 25, 2003 08:37 AMIntel has revealed plans to extend the number of transistors the company can put on chips with existing equipment. The next-generation technique includes a 65-nanometer process that the company said will help develop more capable processors and larger, more cost-effective 300-nanometer wafers, which are used for processors and other semiconductor manufacturing products. Intel said it will begin using the new manufacturing techniques in 2005, when it will be able to double the number of transistors the company can put on a single chip today.