AMD and IBM announced a collaborative breakthrough in processor technology today, marking the first use of two new techniques that advance speed and performance without requiring more power. Chip giant Intel has already produced processors with so-called strained silicon technology that offsets power and heat problems, but the AMD-IBM advance draws on both strained silicon and silicon-on-insulator [SOI] technology, which allows the chip performance increase with today’s power levels, the companies said.
Loading ...
AMD, IBM Build a Better Chip Together
Posted by: Jay Lyman December 13, 2004 10:44 AMAMD and IBM announced a collaborative breakthrough in processor technology today, marking the first use of two new techniques that advance speed and performance without requiring more power. Chip giant Intel has already produced processors with so-called strained silicon technology that offsets power and heat problems, but the AMD-IBM advance draws on both strained silicon and silicon-on-insulator [SOI] technology, which allows the chip performance increase with today’s power levels, the companies said.