Samsung has found a way to increase memory while allowing for the ever-thinner profile of mobile devices, the company announced today. Its eight-die multichip package (MCP) creates an eight-layer chip stack 1.4 mm thick, the space normally taken up by four chips. The chips have a capacity of 3.2 GB. The electronics company said the eight-die MCP is designed for high-capacity mobile devices such as 3G handsets. “Multi-chip packaging is a technology primarily used to circumvent the SoC process,” said Jim Walker of Gartner/Dataquest.
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Samsung Builds Thinner Chip Package
Posted by: Susan B. Shor January 10, 2005 11:50 AMSamsung has found a way to increase memory while allowing for the ever-thinner profile of mobile devices, the company announced today. Its eight-die multichip package (MCP) creates an eight-layer chip stack 1.4 mm thick, the space normally taken up by four chips. The chips have a capacity of 3.2 GB. The electronics company said the eight-die MCP is designed for high-capacity mobile devices such as 3G handsets. “Multi-chip packaging is a technology primarily used to circumvent the SoC process,” said Jim Walker of Gartner/Dataquest.