South Korean electronics and semiconductor giant Samsung claimed a three-dimensional, stacked memory chip breakthrough this week with new technology that shrinks the space needed for stacked chip layers used in mobile phones and other devices. Samsung said by stacking eight 2 gigabit NAND flash memory chips, it could deliver a smaller-footprint wafer-level processed stack package (WSP), a method of stacking silicon chip dies to increase performance while economizing space and energy requirements.
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Samsung Slims Memory Chip Stack
Posted by: Jay Lyman April 14, 2006 11:33 AMSouth Korean electronics and semiconductor giant Samsung claimed a three-dimensional, stacked memory chip breakthrough this week with new technology that shrinks the space needed for stacked chip layers used in mobile phones and other devices. Samsung said by stacking eight 2 gigabit NAND flash memory chips, it could deliver a smaller-footprint wafer-level processed stack package (WSP), a method of stacking silicon chip dies to increase performance while economizing space and energy requirements.