IBM on Thursday announced a method of connecting processors inside of products ranging from cell phones to PCs to supercomputers. This breakthrough — dubbed “through-silicon vias” — allows for a move away from horizontal 2-D chip layouts to 3-D chip stacking, where chips and other components that usually sit side-by-side on a silicon wafer are stacked on top of one another. The technology should extend battery life in wireless devices and increase speed data transfers.
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New IBM Tech Takes Chips to Another Dimension
Posted by: Tim Gray April 12, 2007 01:08 PMIBM on Thursday announced a method of connecting processors inside of products ranging from cell phones to PCs to supercomputers. This breakthrough — dubbed “through-silicon vias” — allows for a move away from horizontal 2-D chip layouts to 3-D chip stacking, where chips and other components that usually sit side-by-side on a silicon wafer are stacked on top of one another. The technology should extend battery life in wireless devices and increase speed data transfers.