Broadcom announced on Monday a new, single-chip high-speed packet access processor that integrates multiple 3G cellular and mobile technologies on a single, low-power, 65 nanometer complementary metal oxide semiconductor die. The “3G phone on a chip,” which Broadcom says is the world’s first such single-chip solution, enables manufacturers to build 3G high-speed uplink packet access phones with breakthrough features, sleek form factors and very long battery life at a lower cost than they can using competing solutions, the Irvine, Calif.-based company said.
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Broadcom Claims First All-in-One 3G Chip
Posted by: Katherine Noyes October 15, 2007 01:49 PMBroadcom announced on Monday a new, single-chip high-speed packet access processor that integrates multiple 3G cellular and mobile technologies on a single, low-power, 65 nanometer complementary metal oxide semiconductor die. The “3G phone on a chip,” which Broadcom says is the world’s first such single-chip solution, enables manufacturers to build 3G high-speed uplink packet access phones with breakthrough features, sleek form factors and very long battery life at a lower cost than they can using competing solutions, the Irvine, Calif.-based company said.