A trio of semiconductor companies have banded together in a joint effort to push the industry into transitioning to a larger, 450mm-sized wafer by 2012. Led by Intel, Samsung and TSMC, the idea is to line up the industry so that all of the required components and manufacturing needs are developed in time to benefit from the larger design. The intended benefit: Lowering the production cost of a computer chip. Basically, a wafer is a slice of semiconductor material that’s formed in a consistent crystalline process that provides the basis for microprocessors.
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Semi Heavies Push Fabs to Upsize Wafers
Posted by: Chris Maxcer May 6, 2008 01:47 PMA trio of semiconductor companies have banded together in a joint effort to push the industry into transitioning to a larger, 450mm-sized wafer by 2012. Led by Intel, Samsung and TSMC, the idea is to line up the industry so that all of the required components and manufacturing needs are developed in time to benefit from the larger design. The intended benefit: Lowering the production cost of a computer chip. Basically, a wafer is a slice of semiconductor material that’s formed in a consistent crystalline process that provides the basis for microprocessors.